Staff Profile
Dr Mohammad Alam
Researcher
Mathematical Sciences Department
Telephone: +44 (0)20 8331 8546
Fax: +44 (0)20 8331 8665
Room: QM255
Email:
Qualifications
November, 2004: Ph. D.
Department of Electronic Engineering, City University of Hong Kong, Hong Kong
Dissertation Title: "Study of interfacial reactions in Ball Grid Array (BGA) solder joints for advanced Integrated Circuit (IC) packaging"
Thesis supervisor: Professor YC Chan,(IEEE Fellow on Electronic Product Reliability).
September 1997: M. Sc. Eng. (Metallurgical),
Dept. of Metallurgical Eng., Bangladesh University of Engineering and Technology (BUET), Dhaka, Bangladesh
Dissertation Title: "Hot Isostatic Diffusion Welding of Titanium Alloys"
February 1995: B. Sc. Eng. (Metallurgical),
Dept. of Metallurgical Eng., BUET, Dhaka, Bangladesh
Dissertation Title: "Dendritic arm Spacing - A non-destructive test to determine the mechanical properties of as-cast materials"
External recognition
1. Senior Member, IEEE, USA,
2. Member, IET, UK
Research/Scholarly interests
1. Thermo-electro-mechanical modeling of chip interconnect materials.
2. Mathematical modeling of metallurgical influences on the reliability and failure analysis of electronic solders.
3. Failure analysis and reliability of advanced electronic packaging
4. Nano-structured interconnects for further miniaturization of electronic packages.
Selected Publications:
1. M. O. Alam, B. Y. Wu, Y. C. Chan and L. Rufer, "Reliability of BGA Solder Joints on the Au/Ni/Cu Bond Pad - Effect of Thicknesses of Au and Ni layer" IEEE Transactions on Device and Materials Reliability, Volume 6, Issue 3, Sept. 2006 Page(s):421 - 428.
2. M. O. Alam, B. Y. Wu, Y. C. Chan, and K. N. Tu, "High electric current density induced interfacial reactions in the micro Ball Grid Array (mBGA) solder joint" Acta Materialia, Vol. 54 (3), pp. 613-621, Feb 2006.
3. M. O. Alam and Y. C. Chan, "Solid State Growth Kinetics of Ni3Sn4 at the Sn-3.5Ag Solder/Ni Interface" Journal of Applied Physics, Vol. 98 (12), pp. 123527:1-4, Dec 15, 2005.
4. M. O. Alam, Y. C. Chan, K. N. Tu, and J. K. Kivilahti, "Effect of 0.5 wt% Cu in Sn-3.5%Ag solder ball on the solid state interfacial reaction with the Au/Ni/Cu bond pad for Ball Grid Array(BGA) application", Communication in the ACS journal Chemistry of Materials, Vol. 17 (9), pp. 2223-2226, May 2005.
5. M. O. Alam, Y. C. Chan, and K. N. Tu, "Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn-Ag solder and Au/electroless Ni(P)/Cu bond pad", Journal of Applied Physics, Vol. 94 (6), pp. 4108-4115, Sept 2003. "
School of Computing and Mathematical Sciences
University of Greenwich
Old Royal Naval College
Park Row
London SE10 9LS
UK
Researcher
Mathematical Sciences Department
Telephone: +44 (0)20 8331 8546
Fax: +44 (0)20 8331 8665
Room: QM255
Email:
Qualifications
November, 2004: Ph. D.
Department of Electronic Engineering, City University of Hong Kong, Hong Kong
Dissertation Title: "Study of interfacial reactions in Ball Grid Array (BGA) solder joints for advanced Integrated Circuit (IC) packaging"
Thesis supervisor: Professor YC Chan,(IEEE Fellow on Electronic Product Reliability).
September 1997: M. Sc. Eng. (Metallurgical),
Dept. of Metallurgical Eng., Bangladesh University of Engineering and Technology (BUET), Dhaka, Bangladesh
Dissertation Title: "Hot Isostatic Diffusion Welding of Titanium Alloys"
February 1995: B. Sc. Eng. (Metallurgical),
Dept. of Metallurgical Eng., BUET, Dhaka, Bangladesh
Dissertation Title: "Dendritic arm Spacing - A non-destructive test to determine the mechanical properties of as-cast materials"
External recognition
1. Senior Member, IEEE, USA,
2. Member, IET, UK
Research/Scholarly interests
1. Thermo-electro-mechanical modeling of chip interconnect materials.
2. Mathematical modeling of metallurgical influences on the reliability and failure analysis of electronic solders.
3. Failure analysis and reliability of advanced electronic packaging
4. Nano-structured interconnects for further miniaturization of electronic packages.
Selected Publications:
1. M. O. Alam, B. Y. Wu, Y. C. Chan and L. Rufer, "Reliability of BGA Solder Joints on the Au/Ni/Cu Bond Pad - Effect of Thicknesses of Au and Ni layer" IEEE Transactions on Device and Materials Reliability, Volume 6, Issue 3, Sept. 2006 Page(s):421 - 428.
2. M. O. Alam, B. Y. Wu, Y. C. Chan, and K. N. Tu, "High electric current density induced interfacial reactions in the micro Ball Grid Array (mBGA) solder joint" Acta Materialia, Vol. 54 (3), pp. 613-621, Feb 2006.
3. M. O. Alam and Y. C. Chan, "Solid State Growth Kinetics of Ni3Sn4 at the Sn-3.5Ag Solder/Ni Interface" Journal of Applied Physics, Vol. 98 (12), pp. 123527:1-4, Dec 15, 2005.
4. M. O. Alam, Y. C. Chan, K. N. Tu, and J. K. Kivilahti, "Effect of 0.5 wt% Cu in Sn-3.5%Ag solder ball on the solid state interfacial reaction with the Au/Ni/Cu bond pad for Ball Grid Array(BGA) application", Communication in the ACS journal Chemistry of Materials, Vol. 17 (9), pp. 2223-2226, May 2005.
5. M. O. Alam, Y. C. Chan, and K. N. Tu, "Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn-Ag solder and Au/electroless Ni(P)/Cu bond pad", Journal of Applied Physics, Vol. 94 (6), pp. 4108-4115, Sept 2003. "
School of Computing and Mathematical Sciences
University of Greenwich
Old Royal Naval College
Park Row
London SE10 9LS
UK