Staff Profile
Dr Md Jahir Rizvi
Researcher
Computer Science Department
Telephone: +44 (0)20 8331 8546
Fax: +44 (0)20 8331 8665
Room: QM255
Email:
Qualifications
PhD in Electronic Packaging Interconnection Technologies (Nov 2007)
University of Greenwich, London, UK
BScEng in Naval Architecture & Marine Engineering (Aug 2001)
Bangladesh University of Engineering & Technology, Dhaka, Bangladesh
External recognition
1. Member, IEEE
2. Associate Member, IMechE
Research/Scholarly interests
Computer Modelling:
Finite Element Analysis (FEA) - Reliability, Creep and Fatigue Failure Analysis,
Computational Fluid Dynamics (CFD) - Heat Transfer and Fluid Flow Analysis, Thermal Management Solution for Electronics etc.
Experiments:
Materials Characterization & Microstructures Evaluation,
Diffusion & Reaction for Thin Solid Films,
Behavioural Studies for Materials under Thermal and Mechanical Loads,
Microelectronics Packaging Interconnection Technology & Integrity,
Design for Manufacture (DfM) of Flexible Circuit Boards,
Non-destructive Testing Methods etc.
School of Computing and Mathematical Sciences
University of Greenwich
Old Royal Naval College
Park Row
London SE10 9LS
UK
Researcher
Computer Science Department
Telephone: +44 (0)20 8331 8546
Fax: +44 (0)20 8331 8665
Room: QM255
Qualifications
PhD in Electronic Packaging Interconnection Technologies (Nov 2007)
University of Greenwich, London, UK
BScEng in Naval Architecture & Marine Engineering (Aug 2001)
Bangladesh University of Engineering & Technology, Dhaka, Bangladesh
External recognition
1. Member, IEEE
2. Associate Member, IMechE
Research/Scholarly interests
Computer Modelling:
Finite Element Analysis (FEA) - Reliability, Creep and Fatigue Failure Analysis,
Computational Fluid Dynamics (CFD) - Heat Transfer and Fluid Flow Analysis, Thermal Management Solution for Electronics etc.
Experiments:
Materials Characterization & Microstructures Evaluation,
Diffusion & Reaction for Thin Solid Films,
Behavioural Studies for Materials under Thermal and Mechanical Loads,
Microelectronics Packaging Interconnection Technology & Integrity,
Design for Manufacture (DfM) of Flexible Circuit Boards,
Non-destructive Testing Methods etc.
School of Computing and Mathematical Sciences
University of Greenwich
Old Royal Naval College
Park Row
London SE10 9LS
UK
