Staff Profile
Dr Chunyan Yin
Researcher
Mathematical Sciences Department
Telephone: +44 (0)20 8331 8445
Fax: +44 (0)20 8331 8665
Room: QM255
Email:
Qualifications
PhD in Computational Science and Engineering
MEng in Materials Engineering
External recognition
Member of IEEE
Technical Sessions Chair of the 2nd ESTC conference (2008), UK
Member of Organizing Committee of HDP’07
Research/Scholarly interests
Prognostic and Health Management of Electrical Systems
Reliability of Electric Devices, Subsea Cables
Computational Modeling
Selected publications
1. C. Y. Yin, C. Best, C. Bailey, S. Stoyanov, M. O. Alam, "Statistical Analysis of the Impacts of Refinishing Process on the Reliability of Microelectronics Components", Submitted to Journal of Microelectronics Reliability.
2. S Stoyanov, C Bailey, M Alam, C Yin etal (2013), "Modelling Methodology for Thermal Analysis of Hot Solder Dip Process", Jnl Microelectronics Reliability (in print summer 2013)
3. Chunyan Yin, Hua Lu, Mahera Musallam, Chris Bailey and C Mark Johnson (2010), “Prognostic Reliability Analysis of Power Electronics Modules”, International Journal of Performability Engineering, Vol.6, pp.513-524.
4. Hua Lu, Chris Bailey, Chunyan Yin (2009), “Design for Reliability of Power Electronics Modules”, Invited paper for Journal of Microelectronics Reliability, Vol.49, pp.1250-1255.
5. Yin, C.Y., Lu, H., et al.(2006), “Macro-Micro Modelling Analysis for an ACF Flip Chip”, Journal of Soldering and Surface Mounting Technology, Vol.18, No.2, pp.27-32.
6. Yin, C.Y., Lu, H., et al.(2004), “Effects of Solder Reflow Process on the Reliability of Flip-Chip on Flex Interconnections Using Anisotropic Conductive Adhesives”, IEEE Transactions on Electronics Packaging Manufacturing, Vol.27, No.4, 2004, pp.254-259.
Recent conference presentations
1. C. Y. Yin, C. Best, C. Bailey, S. Stoyanov, M. O. Alam, "Statistical Analysis of the Impacts of Refinishing Process on the Reliability of Microelectronics Components", 13th International Conference on Electronic Packaging Technology & High Density Packaging, Guilin, China, 2012
School of Computing and Mathematical Sciences
University of Greenwich
Old Royal Naval College
Park Row
London SE10 9LS
UK
Researcher
Mathematical Sciences Department
Telephone: +44 (0)20 8331 8445
Fax: +44 (0)20 8331 8665
Room: QM255
Email:
Qualifications
PhD in Computational Science and Engineering
MEng in Materials Engineering
External recognition
Member of IEEE
Technical Sessions Chair of the 2nd ESTC conference (2008), UK
Member of Organizing Committee of HDP’07
Research/Scholarly interests
Prognostic and Health Management of Electrical Systems
Reliability of Electric Devices, Subsea Cables
Computational Modeling
Selected publications
1. C. Y. Yin, C. Best, C. Bailey, S. Stoyanov, M. O. Alam, "Statistical Analysis of the Impacts of Refinishing Process on the Reliability of Microelectronics Components", Submitted to Journal of Microelectronics Reliability.
2. S Stoyanov, C Bailey, M Alam, C Yin etal (2013), "Modelling Methodology for Thermal Analysis of Hot Solder Dip Process", Jnl Microelectronics Reliability (in print summer 2013)
3. Chunyan Yin, Hua Lu, Mahera Musallam, Chris Bailey and C Mark Johnson (2010), “Prognostic Reliability Analysis of Power Electronics Modules”, International Journal of Performability Engineering, Vol.6, pp.513-524.
4. Hua Lu, Chris Bailey, Chunyan Yin (2009), “Design for Reliability of Power Electronics Modules”, Invited paper for Journal of Microelectronics Reliability, Vol.49, pp.1250-1255.
5. Yin, C.Y., Lu, H., et al.(2006), “Macro-Micro Modelling Analysis for an ACF Flip Chip”, Journal of Soldering and Surface Mounting Technology, Vol.18, No.2, pp.27-32.
6. Yin, C.Y., Lu, H., et al.(2004), “Effects of Solder Reflow Process on the Reliability of Flip-Chip on Flex Interconnections Using Anisotropic Conductive Adhesives”, IEEE Transactions on Electronics Packaging Manufacturing, Vol.27, No.4, 2004, pp.254-259.
Recent conference presentations
1. C. Y. Yin, C. Best, C. Bailey, S. Stoyanov, M. O. Alam, "Statistical Analysis of the Impacts of Refinishing Process on the Reliability of Microelectronics Components", 13th International Conference on Electronic Packaging Technology & High Density Packaging, Guilin, China, 2012
School of Computing and Mathematical Sciences
University of Greenwich
Old Royal Naval College
Park Row
London SE10 9LS
UK